官方网站:http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=55
投稿网址:http://mc.manuscriptcentral.com/edl
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
《IEEE电子器件快报》发表了有关电子和离子集成电路器件和互连的理论、建模、设计、性能和可靠性的原创和重要贡献,涉及绝缘体、金属、有机材料、微等离子体、半导体、量子效应结构、真空器件、以及在生物电子学、生物医学电子学、计算、通信、显示、微电子力学、成像、微驱动器、纳米电子学、光电子学、光电学、功率电子学和微传感器的材料。
大类学科 | 分区 | 小类学科 | 分区 | Top期刊 | 综述期刊 |
工程技术 | 2区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 | 2区 | 否 | 否 |
JCR分区等级 | JCR所属学科 | 分区 | 影响因子 |
Q1 | ENGINEERING, ELECTRICAL & ELECTRONIC | Q1 | 4.816 |
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