官方网站:http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=15
投稿网址:http://mc.manuscriptcentral.com/temc-ieee
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
《IEEE电磁兼容性汇刊》发表了与电磁兼容性(EMC)所有学科和相关方法相关的原始和重要贡献,以预测、评估和预防电磁干扰(EMI)并提高设备/产品的抗扰度。本出版物的范围包括但不限于电磁环境;干扰控制;电磁兼容性和电磁干扰建模;大功率电磁学;电磁兼容性标准、电磁兼容性测量方法;计算电磁学和信号及功率完整性,如适用或与电磁兼容性问题直接相关;传输通信线路;静电放电和雷电效应;无线和光学技术中的电磁兼容性;印刷电路板和系统设计中的电磁兼容性。
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