Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are:Soldering science and technologyNovel soldering processes and new solder alloysSurface mount technology (SMT)Surface mount assemblyAdvanced packaging technologies and 3D interconnectsFlip chip/BGA/SiP/TSVNovel substrates and embedded componentsSolderable finishes and coatingsScreen printingConductive adhesives and conformal coatingsReliabilityQuality controlInspection and testingRework and repairEnvironmental aspects
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