Journal of Semiconductor Technology and Science is published to provide a forum for R&D people involved in wider scope of the integrated circuit technology, i.e., VLSI fabrication process technology, device technology, circuit design, packaging, test and other novel applications of this ever scaling technology. When IC was invented, these people worked together in one place, and understood every details of the flow from bare silicon to package testing. However, as the IC evolves with Moore’s curve, in-depth knowledge content has exploded, and our individual expertise has to become narrowed down. As a result, different branches in the technical society were created, and have made it more difficult to communicate as a whole. The fisherman, however, always knows that he can capture more fish at the border where warm and cold-water meet. Thus, we decided to break the knowledge barrier, by providing communication channel for people working in relevant VLSI technology in common subject “Device & Design Integration”. Treaties on core technology that will affect the device including CMOS and MEMS devices, from the substrate to gate fabrication and its characterization and analysis are our major focus. The other focus is how to make the device function in a system and its verification the design. This device & design forum should provide better use of the other information and enhance the overall VLSI technology, eventually serving better to create more efficient devices and systems.
《半导体技术与科学》杂志的出版，旨在为从事更广泛集成电路技术的研发人员提供一个论坛。、超大规模集成电路制造工艺技术、器件技术、电路设计、封装、测试等新技术的不断应用。当IC被发明时，这些人在一个地方一起工作，并且了解从裸硅到封装测试的每一个细节。然而，随着集成电路随着摩尔曲线的发展而发展，深入的知识内容呈爆炸式增长，我们个人的专业知识也必须缩小。因此，技术社会中出现了不同的分支，使得作为一个整体的沟通变得更加困难。然而，渔夫总是知道，他可以在温暖和寒冷的水相遇的边界捕获更多的鱼。因此，我们决定打破知识壁垒，为从事VLSI相关技术工作的人员提供共同的课题“设备与设计集成”的沟通渠道。关于影响器件的核心技术的条约，包括CMOS和MEMS器件，从基片到栅极的制造及其表征和分析是我们的主要重点。另一个重点是如何使器件在系统中发挥作用，并对其进行验证设计。这个设备与设计论坛应该提供更好地利用其他信息，并提高整体超大规模集成电路技术，最终更好地服务于创建更高效的设备和系统。
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